Host Interface2x USB 3.0 Type C, SuperSpeed
FrontPanel Support
XCKU115-1FLVA available on special order
Memory4 GiByte DDR4, 72-bit wide data interface (ECC capable)
NV Memory2x 16 MiB System Flash
32 MiB FPGA Flash
OscillatorProgrammable, 0.16-350 MHz
DC Input+4.5+16VDC
DC Input Ripple50mVp-p
Operating Temperature0+70ºC
Operating Temperature
(Industrial Version)
Storage Temperature-500+100ºC
Oscillator Frequency (Programmable) 0.16 350MHz
Oscillator Period Jitter10ps pk-pk
Oscillator Reference Crystal Freq. Stability±50

PCB Footprint

The PCB is 145mm x 85mm with six mounting holes spaced as shown in the drawings below.  The four mounting holes adjacent to the mezzanine connectors accept Samtec JSO jack standoffs for controlled mating and unmating with a carrier board. The remaining two holes at the left side of the board accept size M3 mounting screws. The M3 mounting holes are plated through but are electrically isolated from all signals on the XEM8350. The JSO mounting holes are unplated. The three connectors (2x USB and DC power) overhang the PCB slightly in order to accommodate mounting within an enclosure.

The XEM8350 has three high-density 0.5mm connectors providing access to 332 I/O, 28 multi-gigabit transceivers, and multiple electrically-programmable adjustable voltages.

Mechanical Drawing

The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.

Mating Board Diagram

Use the mating diagram below to orient and design peripheral mating hardware. Note that this is a top-down view and mates to the bottom of the XEM8350. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.

For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.