|Host Interface||2x USB 3.0 Type C, SuperSpeed|
XCKU115-1FLVA available on special order
|Memory||4 GiByte DDR4, 72-bit wide data interface (ECC capable)|
|NV Memory||2x 16 MiB System Flash|
32 MiB FPGA Flash
|Oscillator||Programmable, 0.16-350 MHz|
|DC Input Ripple||–||–||50||mVp-p|
|Oscillator Frequency (Programmable)||0.16||–||350||MHz|
|Oscillator Period Jitter||10||ps pk-pk|
|Oscillator Reference Crystal Freq. Stability||±50|
The PCB is 145mm x 85mm with six mounting holes spaced as shown in the drawings below. The four mounting holes adjacent to the mezzanine connectors accept Samtec JSO jack standoffs for controlled mating and unmating with a carrier board. The remaining two holes at the left side of the board accept size M3 mounting screws. The M3 mounting holes are plated through but are electrically isolated from all signals on the XEM8350. The JSO mounting holes are unplated. The three connectors (2x USB and DC power) overhang the PCB slightly in order to accommodate mounting within an enclosure.
The XEM8350 has three high-density 0.5mm connectors providing access to 332 I/O, 28 multi-gigabit transceivers, and multiple electrically-programmable adjustable voltages.
The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.
Mating Board Diagram
Use the mating diagram below to orient and design peripheral mating hardware. Note that this is a top-down view and mates to the bottom of the XEM8350. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.
For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.