Host Interface2x USB 3.0 Type C, SuperSpeed
FrontPanel Support
XCKU115-1FLVA available on special order
Memory4 GiByte DDR4, 72-bit wide data interface (ECC capable)
NV Memory2x 16 MiB System Flash
32 MiB FPGA Flash
OscillatorProgrammable, 0.16-350 MHz
FPGA I/O332 HP I/O (Banks 24, 25, 44, 45, 46, 47, 48)
FPGA MGT28 GTH Transceivers (up to 16.375 Gb for -3E speed)
Dimensions145mm x 85mm (5.71″ x 3.35″)
DC Input+4.5+16VDC
DC Input Ripple50mVp-p
Operating Temperature0+70ºC
Operating Temperature
(Extended Version)
Storage Temperature-500+100ºC
Oscillator Frequency (Programmable) 0.16 350MHz
Oscillator Period Jitter10ps pk-pk
Oscillator Reference Crystal Freq. Stability±50

PCB Footprint

The PCB is 145mm x 85mm with six mounting holes spaced as shown in the drawings below.  The four mounting holes adjacent to the mezzanine connectors accept Samtec JSO jack standoffs for controlled mating and unmating with a carrier board. The remaining two holes at the left side of the board accept size M3 mounting screws. The M3 mounting holes are plated through but are electrically isolated from all signals on the XEM8350. The JSO mounting holes are unplated. The three connectors (2x USB and DC power) overhang the PCB slightly in order to accommodate mounting within an enclosure.

The XEM8350 has three high-density 0.5mm connectors providing access to 332 I/O, 28 multi-gigabit transceivers, and multiple electrically-programmable adjustable voltages.

Mechanical Drawing

The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.

Mating Board Diagram

Use the mating diagram below to orient and design peripheral mating hardware. Note that this is a top-down view and mates to the bottom of the XEM8350. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.

For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.

Heat Sink

The device has been fitted with two heat sink anchors, proximate to the FPGA for mounting a passive or active heat sink. The following heat sink has been tested with the XEM8350.

Opal Kelly IncorporatedFANSINK-40X40Active heatsink with DC fan

The active heat sink above includes a small fan which connects to the fan controller on-board for manual or automatic fan control. The fan is powered directly by the input supply to the XEM8350. The fan is specified for a nominal operating voltage of 6-13.8 VDC. Supply voltages outside of this range might be possible, but could lead to fan startup and performance issues under certain conditions. The fan is powered directly by the input supply, and therefore the maximum fan RPM is related to the external supply voltage. Designs with high FPGA on-chip power consumption must take this into account when selecting an operating voltage and heat sink.

The FANSINK-40X40 is available for purchase directly from Opal Kelly.

Heat Sink Dimensions

DIY Fansink Solution

The following components may be used to craft a suitable alternative for the FANSINK-40X40:

ComponentDigi-Key P/nDescription
Aavid 375024B60024GMouser 532-375024B60024Heatsink with anchor arms
CUI CFM-3510CF-190-277Mouser 179-CFM3510CF190277
Digi-Key 2223-CFM-3510CF-190-277-ND
McMaster-Carr 92196A235McMaster-Carr 92196A235Mounting bolt
Molex 510210200Mouser 538-51021-0200
Digi-Key WM1720-ND
Power connector
Molex 500798xxxDigi-Key WM25388CT-NDCrimp terminals
Molex 500798xxxDigi-Key WM15250-NDPre-crimped cable assemblies