Specifications
| Host Interface | USB-C 2.0 UART (USB-C) |
| FPGA | XCZU7CG-FFVC1156E XCZU7EG-1FFVC1156E XCZU7EV-1FFVC1156E XCZU11EG-1FFVC1156E (available on special order) |
| CPU Memory | 36 Gbit DDR4, 64-bit wide data interface with 8-bit ECC |
| FPGA Memory | 36 Gbit DDR4, 72-bit wide data interface (ECC capable) |
| NV Memory | MicroSD Socket (High-speed, 50 MHz) |
| Oscillator | Programmable, 100 Hz – 350 MHz (Si5341) |
| CPU I/O | 48 I/O (Banks 500, 501, 502) |
| CPU MGT | 4 GTR transceivers (6.0 Gb/s) |
| FPGA I/O | 152 HP I/O (Banks 28, 67, 68) 48 HD I/O (Banks 87, 88) |
| FPGA MGT | 20 GTH transceivers (12.5 Gb/s; 16.3Gb/s in -2 speed grade) |
| MINIMUM | TYPICAL | MAXIMUM | UNITS | |
|---|---|---|---|---|
| DC Input | +6 | – | +15 | VDC |
| DC Input Ripple | – | – | 50 | mVp-p |
| Operating Temperature | 0 | – | +70 | ºC |
| Storage Temperature | -50 | 0 | +100 | ºC |
| Weight | 92 | grams | ||
| Oscillator Frequency (Programmable) | 0.0001 | – | 350 | MHz |
| Oscillator RMS Phase Jitter | 90 | fs | ||
| Oscillator Reference Crystal Freq. Stability | ±25 | ppm |
PCB Footprint
The PCB is 112mm x 83mm with four mounting holes spaced as shown in the drawings below. The four mounting holes accept Samtec JSO jack standoffs for controlled mating and unmating with a carrier board. The JSO mounting holes are unplated. The two vertical-launch USB connectors allow flexible mounting configurations within an enclosure.
The ECM1900 has three high-density 0.5mm connectors providing access to 248 I/O, 24 multi-gigabit transceivers, and multiple electrically-programmable adjustable voltages.
Mechanical Drawing
The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.
Mating Board Diagram
Use the mating diagram below to orient and design peripheral mating hardware. Note that this is a top-down view and mates to the bottom of the ECM1900. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.
For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.
Heat Sink
The module is designed to accept a Radian EZ Snap clip-on fansink.
| MANUFACTURER | PART NUMBER | DESCRIPTION |
|---|---|---|
| Opal Kelly Incorporated | FANSINK-35X35 | Active heatsink with DC fan |
The active heat sink above includes a small fan which connects to the fan controller on-board for manual or automatic fan speed control. The fan is powered directly by the input supply to the ECM1900. The fan is specified for a nominal operating voltage of 7-13.8 VDC. Supply voltages outside of this range might be possible, but could lead to fan startup and performance issues under certain conditions. The fan is powered directly by the input supply, and therefore the maximum fan RPM is related to the external supply voltage. Designs with high FPGA on-chip power consumption must take this into account when selecting an operating voltage and heat sink.
The FANSINK-35X35 is available for purchase directly from Opal Kelly.
Heat Sink Dimensions
