DDR3 Memory
The Micron DDR3 SDRAM is connected exclusively to the 1.5-v I/O on Banks 33 and 34 of the FPGA. The tables below list these connections.
The following resources are available to help provide guidance for designs that involve this memory:
- How-To Apply DDR MIG Settings and Vivado Board File to generate Xilinx’s MIG IP Core.
- The RAMTester sample reads and writes this memory via FrontPanel pipe endpoints.
- The Camera Reference Design provides a memory interface for frame buffering.
- The XEM7350 Pins Reference can generate a constraints file (click on Export) with complete pin mapping and I/O constraints for use in your design.
Connection Tables
| DDR3 PIN | FPGA PIN |
|---|---|
| RESETn | AA4 |
| CKp | W6 |
| CKn | W5 |
| CKE | AB5 |
| CSn | AA5 |
| RASn | AC2 |
| CASn | AA3 |
| WEn | AA2 |
| DQS0p | AF5 |
| DQS0n | AF4 |
| DQS1p | W10 |
| DQS1n | W9 |
| DM0 | AD4 |
| DM1 | V11 |
| ODT | AB6 |
| DDR3 PIN | FPGA PIN |
|---|---|
| A0 | AC1 |
| A1 | AB1 |
| A2 | V1 |
| A3 | V2 |
| A4 | Y2 |
| A5 | Y3 |
| A6 | V4 |
| A7 | V6 |
| A8 | U7 |
| A9 | W3 |
| A10 | V3 |
| A11 | U1 |
| A12 | U2 |
| A13 | U5 |
| A14 | U6 |
| BA0 | AB2 |
| BA1 | Y1 |
| BA2 | W1 |
| DDR3 PIN | FPGA PIN |
|---|---|
| D0 | AD1 |
| D1 | AE1 |
| D2 | AE3 |
| D3 | AE2 |
| D4 | AE6 |
| D5 | AE5 |
| D6 | AF3 |
| D7 | AF2 |
| D8 | W11 |
| D9 | V8 |
| D10 | V7 |
| D11 | Y8 |
| D12 | Y7 |
| D13 | Y11 |
| D14 | Y10 |
| D15 | V9 |
MIG Settings
Kintex-7 devices support external, high-performance memory through the use of the Memory Interface Generator (MIG) provided by Xilinx. MIG produces a custom memory interface core that may be included in your design. These parameters have been used successfully within Opal Kelly but your design needs may require deviations.
| PARAMETER | XEM7350-K70T | XEM7350-K160T |
|---|---|---|
| System Clock Type | Differential | |
| Reference Clock Type | Use System Clock | |
| System Reset Polarity | Active High | |
| Debug Port | Off | |
| Internal Vref | Disabled | |
| IO Power Reduction | On | |
| DCI for DQ / DQS / DM | Enabled | |
| Internal Termination | 40 Ω | |
| Memory | DDR3_SDRAM | |
| Interface | Native | |
| Design Clock Frequency | 2500ps (400.0 MHz) | 1250ps (800.0 MHz) |
| Phy to Controller Ratio | 4:1 | 4:1 |
| Input Clock Period | 5000ps | 5000ps |
| CLKFBOUT_MULT | 4 | 8 |
| DIVCLK_DIVIDE | 1 | |
| Vcc_aux_io | 2.0V | |
| Memory Type | Components | |
| Memory Part | MT41K256M16XX-125 | |
| Data Width | 16 | |
| ECC | Disabled | |
| Data Mask | Enabled | |
| Ordering | Normal | |
| Burst Length | 8 – Fixed | |
| Read Burst Type | Sequential | |
| CAS Latency | 6 | 11 |
| Output Drive Strength | RZQ/6 | |
| Controller CS Option | Enable | |
| Rtt NOM – ODT | RZQ/6 | |
| Rtt WR – Dynamic ODT | Dynamic ODT off | |
| Memory Address Mapping | BANK_ROW_COLUMN | |
| Bank 33 | Byte Group T0 : DQ[8-15] | |
| Bank 34 | Byte Group T0 : Address/Ctrl-0 Byte Group T1 : Address/Ctrl-1 Byte Group T2 : Address/Ctrl-2 Byte Group T3 : DQ[0-7] | |
| sys_clk_p/n | AC4/AC3 |