Specifications
| Host Interface | USB 3.0 Micro B, SuperSpeed FrontPanel Support |
| FPGA | XC7K70T-1FBG676C XC7K160T-1FFG676C XC7K410T-1FFG676C |
| Memory | 512 MiByte DDR3, 16-bit wide data interface |
| NV Memory | 16 MiB System Flash 16 MiB FPGA Flash |
| Oscillator | 200 MHz (General (Fabric) Reference) 100 MHz (Transceiver Reference) |
| FPGA I/O Voltage | See Powering the XEM7350 |
| MINIMUM | TYPICAL | MAXIMUM | UNITS | |
|---|---|---|---|---|
| DC Input | +4.5 | +5.0 | +5.5 | VDC |
| DC Input Ripple | – | – | 50 | mVp-p |
| Operating Temperature | 0 | – | +70 | ºC |
| Operating Temperature (Industrial Version) | -40 | – | +85 | ºC |
| Storage Temperature | -50 | 0 | +100 | ºC |
| Weight | 50 | grams | ||
| Oscillator Frequency (General (Fabric) Reference) | 200 | MHz | ||
| Oscillator Freq. Stability (General (Fabric) Reference) | ±50 | ppm | ||
| Oscillator Period Jitter (General (Fabric) Reference) | – | 1.2 | 1.7 | ps RMS |
| Oscillator Frequency (Transceiver Reference) | 100 | MHz | ||
| Oscillator Freq. Stability (Transceiver Reference) | ±50 | ppm | ||
| Oscillator Phase Jitter (Transceiver Reference) | – | – | 1 | ps |
PCB Footprint
The PCB is 80mm x 70mm with four mounting holes (M2 metric screws) spaced as shown in the figures below. These mounting holes are electrically isolated from all signals on the XEM7350. The two connectors (USB and DC power) overhang the PCB by approximately 1.3mm in order to accommodate mounting within an enclosure.
The XEM7350 has a single high pin count (HPC) FMC connector providing access to over 160 I/O, 8 multi-gigabit transceivers, and electrically-programmable adjustable voltage per the VITA-57 standard.
Mechanical Drawing
Heatsink
The device has been fitted with two heatsink anchors, proximate to the FPGA for mounting a passive or active heat sink. New revisions of the PCB allow for a BGA clip on fansink to be used. The following heat sinks have been tested with the XEM7350.
| MANUFACTURER | PART NUMBER | DESCRIPTION | COMPATIBILITY |
|---|---|---|---|
| Opal Kelly Incorporated | FANSINK-08 | Custom BGA clip on heatsink with fan | Rev FXX and newer |
| Opal Kelly Incorporated | FANSINK-30X30 | Custom anchor clip heatsink with fan | Rev FXX and older |
| Aavid Termalloy | 374524B60023G | Off-the-shelf passive (No fan) | Rev FXX and older |
The active heat sinks above were custom built based on design specifications provided by Opal Kelly to mate to the XEM7350. They includes a small fan which connects to the fan controller on-board for manual or automatic fan control. They are available for purchase directly from Opal Kelly.
The customized anchor clip heatsink with fan can be ordered from directly Aavid Termalloy using part number 3358230-PAL03010-P0 if desired. The listed passive heatsink can be ordered from distributors such as Arrow Electronics and Newark Electronics.
Installation
The thermal transfer material on the bottom of the heatsink is a phase change medium that is sandwiched to the FPGA surface and softens for conductivity under the heat and pressure of attachment.
FANSINK-08
The BGA clip heatsink has a plastic clip that grips onto the BGA package itself. Before installation, remove the protective plastic from the thermal transfer material on the bottom of the heatsink. Place the heatsink on the board in the orientation shown in the image below. Clip the plastic BGA clip over one side of the FPGA. Press the clip horizontally towards the un-clipped side with firm but gentle pressure, at the same time you press down on the un-clipped side, to get the second clip over the other edge of the FPGA and to secure the heatsink in place.
FANSINK-30X30
To install, you should be able to hook one end of the clip on one of the anchors, then, while applying even pressure to the heatsink to make sure the FPGA itself has even pressure, hold that in place while you press the other end of the clip into the anchor.
Dimensions
Note that all dimensions are in (mm) with dimensions in inches in brackets.
FANSINK-08
FANSINK-30X30
