Specifications
| Host Interface | USB 3.0 Type-C FrontPanel Support |
| FPGA | XCAU25P-2FFVB676E |
| FPGA Memory | 2 GiByte DDR4 (32-bit wide data interface) |
| NV Memory (System) | 16 MiB SPI Flash |
| NV Memory | 32 MiB QSPI FPGA Flash (supports FPGA gateware boot) |
| Clocks | 100 MHz and 125 MHz fixed oscillators |
| FPGA I/O | 77 HP I/O (Banks 64, 67) 72 HD I/O (Banks 84, 86, 87) |
| FPGA MGT | 12 GTY transceivers (16.375 Gb/s) |
| Dimensions | 100 x 70 mm (3.94 x 2.76″) |
| MINIMUM | TYPICAL | MAXIMUM | UNITS | |
|---|---|---|---|---|
| DC Input | +7.5 | – | +15.0 | VDC |
| DC Input Ripple | – | – | 50 | mVp-p |
| Operating Temperature | 0 | – | +70 | ºC |
| Storage Temperature | -50 | 0 | +100 | ºC |
| Weight | 49.5 | grams | ||
| Oscillator Frequency (DDR4/FPGA Fabric) | 100 | MHz | ||
| Oscillator Frequency (Transceivers) | 125 | MHz |
PCB Footprint
The XEM8310 PCB is 100mm x 70mm (3.94″ x 2.76″) with four mounting holes placed near the corners. These mounting holes are electrically isolated from all signals on the XEM8310. Power and USB Type C are located along one edge of the PCB. Three 80-pin expansion connectors are available on the bottom-side of the PCB.
Schematics
Electrical schematics are provided in redacted form through Pins Downloads. You must be a registered customer to download these schematics. The FrontPanel SDK and related design details are proprietary and confidential. Schematics related to the implementation have been removed and are unavailable.
Visit Pins Downloads > FPGA Board Schematics > XEM8310-AU25P-REV-Schematic.pdf
Mechanical Drawing
The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.
Mating Board Diagram
Use the mating diagram below to orient and design peripheral mating hardware. Note that this is a top-down view and mates to the bottom of the XEM8310. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.
For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.
Heat Sink
An active (fan-based) heatsink is available as an add on to install on the FPGA for cooling. The fan enable can be controlled over the FrontPanel API. See the Device Settings documentation for more information.
The fansink is Radian part number FI27/1.3+Y+T725.
The fansink has a nominal operating voltage of 12 V and a recommended operating range of 10.8 V to 13.2 V. The fansink is powered directly by the external power supply connected to the XEM8310. It is recommended to keep the external supply voltage within this range whenever the fansink is enabled.
