Specifications
| Host Interface | USB 3.0 Type B, SuperSpeed FrontPanel Support |
| FPGA | XC7K160T-1FFG676C (XEM7360-K160T) XC7K160T-1FFG676I (XEM7360-K160TI) XC7K160T-3FFG676E (XEM7360-K160T-3E) XC7K410T-1FFG676C (XEM7360-K410T) XC7K410T-3FFG676E (XEM7360-K410T-3E) |
| Memory | 2 GiByte DDR3, 32-bit wide data interface |
| NV Memory | 16 MiB System Flash 16 MiB FPGA Flash |
| Oscillator | 200 MHz (General (Fabric) Reference) 100 MHz (Transceiver Reference) |
| FPGA I/O Voltage | See Powering the XEM7360 |
| MINIMUM | TYPICAL | MAXIMUM | UNITS | |
|---|---|---|---|---|
| DC Input | +4.5 | +5.0 | +5.5 | VDC |
| DC Input Ripple | – | – | 50 | mVp-p |
| Operating Temperature | 0 | – | +70 | ºC |
| Storage Temperature | -50 | 0 | +100 | ºC |
| Weight | 62 | grams | ||
| Oscillator Frequency (General (Fabric) Reference) | 200 | MHz | ||
| Oscillator Freq. Stability (General (Fabric) Reference) | ±50 | ppm | ||
| Oscillator Period Jitter (General (Fabric) Reference) | 2.5 | ps RMS | ||
| Oscillator Frequency (Transceiver Reference) | 100 | MHz | ||
| Oscillator Freq. Stability (Transceiver Reference) | ±50 | ppm | ||
| Oscillator Period Jitter (Transceiver Reference) | 2.5 | ps RMS |
PCB Footprint
The XEM7360 PCB is 100mm x 70mm with four mounting holes (M2 metric screws) spaced as shown in the figures below. These mounting holes are electrically isolated from all signals on the XEM7360. The two connectors (USB and DC power) overhang the PCB by approximately 1.3mm in order to accommodate mounting within an enclosure.
The XEM7360 has two high-density 0.5mm connectors providing access to 193 I/O, 8 multi-gigabit transceivers, and multiple electrically-programmable adjustable voltages.
Mechanical Drawing
The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.
All dimensions in mm.
Mating Board Diagram
Use the mating diagram below to orient and design peripheral mating hardware. Note that this is a top-down view and mates to the bottom of the XEM7360. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.
For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.
Heatsink
The device has been fitted with two heatsink anchors, proximate to the FPGA for mounting a passive or active heat sink. The following heat sink has been tested with the XEM7360.
| MANUFACTURER | PART NUMBER | DESCRIPTION |
|---|---|---|
| Opal Kelly Incorporated | FANSINK-30X30-MC | Custom with fan mount |
The active heat sink above was custom built based on design specifications provided by Opal Kelly to mate to the XEM7360. It includes a small fan which connects to the fan controller on-board for manual or automatic fan control. It is available for purchase directly from Opal Kelly.
Installation
The thermal transfer material on the bottom of the heatsink is a phase change medium that is sandwiched to the FPGA surface and softens for conductivity under the heat and pressure of the clip. To install, you should be able to hook one end of the clip on one of the anchors, then, while applying even pressure to the heatsink to make sure the FPGA itself has even pressure, hold that in place while you press the other end of the clip into the anchor.
Dimensions
Note that all dimensions are in (mm) with dimensions in inches in brackets.
