Specifications
| Host Interface | USB 3.2 Gen 2×1 Type-C (SuperSpeed USB 10Gbps) FrontPanel Support |
| FPGA | Artix UltraScale+ XCAU10P-1FFVB676E |
| FPGA Memory | 1 GiByte DDR4 (16-bit wide data interface) DDR4-2133 |
| NV Memory | 32 MiB QSPI Flash (supports FPGA gateware boot) |
| Clocks | 156.25 MHz fixed oscillator |
| FPGA I/O (SYZYGY) | 51 HP I/O (Bank 64) 45 HD I/O (Banks 84, 85, 86) |
| Dimensions | 100mm x 100mm (3.94″ x 3.94″) |
| MINIMUM | Nominal | MAXIMUM | UNITS | |
|---|---|---|---|---|
| USB VBUS input, HOST connector1 | +4.25 | +5.0 | +5.5 | VDC |
| USB VBUS input, POWER connector, 9V PD mode1 | +8.05 | +9.0 | +9.95 | VDC |
| USB VBUS input, POWER connector, 15V PD mode1 | +13.75 | +15.0 | +16.25 | VDC |
| Operating temperature | 0 | – | +70 | ºC |
| Storage temperature | -40 | – | +85 | ºC |
| Weight2 | 51 | grams | ||
| Oscillator frequency (FPGA fabric and DDR4) | 156.25 | MHz |
Notes:
- This is the acceptable voltage range at the SZG-HUB1450 input connector. It includes an allowance for voltage drop due to IR losses in the cable.
- Nominal weight does not include heatsink or fansink.
PCB Footprint
The SZG-HUB1450 PCB has an octagon shape with overall dimensions of 100mm x 100mm (3.94″ x 3.94″) and four equally-spaced mounting holes along the perimeter. These mounting holes are electrically isolated from all signals on the SZG-HUB1450. Three standard SYZYGY connectors are located along three sides of the PCB. Two USB-C connectors are located on one side of the PCB. The HOST connector provides host interface connection and USB power. The POWER connector provides optional power from a USB Power Delivery source.
Schematics
Electrical schematics are not provided for the SZG-HUB1450. All relevant system design information can be found in this documentation space.
Mechanical Drawing
The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats. Please note that the SZG-HUB1450 is a development platform and not intended for production deployment and is subject to change without notice. For a lifecycle-managed module, please see the XEM8305-AU15P and XEM8310-AU25P modules.
SYZYGY Expansion
The SZG-HUB1450 supports up to three standard SYZYGY peripherals for expansion. For more information, visit syzygyfpga.io and the SYZYGY Ports page.
Heatsink
A platefin heatsink is installed on the FPGA for passive cooling. The heatsink is Radian part number INL27001-10/1.3Y+T725, or Opal Kelly part number HEATSINK-01.
Although the passive heatsink provides sufficient thermal dissipation in most use cases, an active fansink may be installed on the FPGA for more demanding applications. The compatible heatsink is Radian part number FJ27/1.3+Y+T725, or Opal Kelly part number FANSINK-09. The fansink is powered by +5 VDC which is supplied by the 2-pin connector on the SZG-HUB1450 labeled “FAN”. The fan must be enabled and disabled through the FrontPanel API. See the Device Settings documentation for more information.
The fansink has an inrush current which may exceed the power supply capabilities in some configurations (for example, when powering the SZG-HUB1450 from a USB 2.0 host using a Type A to Type C cable). In this case, additional power must be provided through the USB-C POWER input.
The recommended tool for removing or installing a heatsink or fansink is Radian HS8132. The platefin attaches to the FPGA using a strong thermal adhesive. Use care when removing the platefin, and remove any residual adhesive from the FPGA before installing a new heatsink or fansink. See the Radian EZ Snap Clip page for installation instructions.