Specifications

Host InterfaceUSB 3.0 Micro B, SuperSpeed
FrontPanel Support
FPGAXC6SLX45-2FGG
XC6SLX150-2FGG
Memory128 MiByte DDR2, 16-bit wide data interface
NV Memory16 MiB System Flash
16 MiB FPGA Flash
Oscillator100 MHz
FPGA I/O VoltageSee Powering the XEM6310
MINIMUMTYPICALMAXIMUMUNITS
DC Input+4.5+5.0+5.5VDC
DC Input Ripple50mVp-p
Operating Temperature0+70ºC
Storage Temperature-500+100ºC
Weight23grams
Oscillator Frequency100MHz
Oscillator Freq. Stability±50ppm
Oscillator Phase Jitter –0.5 1ps RMS

PCB Footprint

The XEM6310 PCB is 75mm x 50mm with four mounting holes (M2 metric screws) spaced as shown in the figures below.  These mounting holes are electrically isolated from all signals on the XEM6310.  The two connectors (USB and DC power) overhang the PCB by approximately 1mm in order to accommodate mounting within an enclosure.

The XEM6310 has two high-density 80-pin connectors on the bottom side which provide access to many FPGA pins, power, and JTAG.

BRK6110 Breakout Board

A simple breakout board (the BRK6110) is provided as an optional accessory to the XEM6310.  This breakout board provides DC power, JTAG connector, and easy access to the high-density connectors on the XEM6310 by routing them to lower-density 2mm-spaced thru-holes.  The breakout board also provides a convenient reference for building boards that will mate to the XEM6310.

Opal Kelly reserves the right to change the form-factor and possibly pinout of the BRK6110.  Therefore, unlike the XEM6310, it is not intended or recommended for production integration.

Full schematics and Gerber artwork files for the BRK6110 are provided free of charge.  If your application depends on the existing form-factor, you may reproduce this board from these documents.

A mechanical drawing of the BRK6110 is also shown in the BRK6110 Breakout Board section of this manual.

Mechanical Drawing