Specifications
| Host Interface | USB 3.0 Type C, SuperSpeed FrontPanel Support |
| FPGA | XC7A75T-1FGG484C XC7A200T-1FBG484C |
| Memory | 1 GiByte DDR3, 32-bit wide data interface |
| NV Memory | 16 MiB System Flash 16 MiB FPGA Flash |
| Oscillator | 200 MHz |
| FPGA I/O Voltage | See Powering the XEM7310 |
| MINIMUM | TYPICAL | MAXIMUM | UNITS | |
|---|---|---|---|---|
| DC Input | +4.5 | +5.0 | +5.5 | VDC |
| DC Input Ripple | – | – | 50 | mVp-p |
| Operating Temperature | 0 | – | +70 | ºC |
| Storage Temperature | -50 | 0 | +100 | ºC |
| Weight | 24 | grams | ||
| Oscillator Frequency | 200 | MHz | ||
| Oscillator Freq. Stability | ±50 | ppm | ||
| Oscillator Period Jitter | 2.5 | ps RMS |
| A75 | A200 | |
|---|---|---|
| System Logic Cells | 75,520 | 215,360 |
| CLB Flip-Flops | 94,400 | 269,200 |
| CLB LUTs | 47,200 | 134,600 |
| Max. Distributed RAM (Kb) | 892 | 2,888 |
| Block RAM | 210 blocks (3,780 Kb) | 730 blocks (13,140 Kb) |
| DSP Slices | 180 | 740 |
PCB Footprint
The XEM7310 PCB is 75mm x 50mm with four mounting holes (M2 metric screws) spaced as shown in the mechanical drawing below. These mounting holes are electrically isolated from all signals on the XEM7310. The two connectors (USB and DC power) overhang the PCB by approximately 1.3mm in order to accommodate mounting within an enclosure.
Mechanical Drawing
The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.
Mating Board Diagram
Use the mating diagram below to orient and design peripheral mating hardware. Note that this is a top-down view and mates to the bottom of the XEM7310. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.
For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.
