This reference is provided to help guide you through the design process of a mating peripheral to the FOMD-ACV. It is not intended to be a comprehensive instruction manual. While we put forth great effort to reduce the effort required to build an FPGA-enabled platform, there are hundreds of pages of product documentation from Intel that should be considered. Use this guide as a roadmap and starting point for your design effort.

• FOMD-ACV Specifications
• BRKD-ACV Breakout Board
• Intel Power Estimator

Input power to the FOMD-ACV must be applied through the SODIMM connector. For information on the supply voltage requirements, see the Power page of the FOMD-ACV documentation. For information on SODIMM connector pin assignments, see the FOMD-ACV-A4 Pins Reference.

The total operating power budget is an important system consideration. The power budget for the FOMD-ACV is highly dependent on the FPGA’s operating parameters and this can only be determined in the context of an actual target design.

The FOMD-ACV includes several on-board regulators which are powered by the input supply. The I/O supplies must be provided externally. The VCCBAT is provided by on-board regulators by default, but can be changed to an external supply. See the Power page for details and requirements of each supply rail.

Details on the available standards can be found in the following Intel documentation:

• Cyclone V Device Datasheet (CV-51002)
• Cyclone V Device Handbook Volume 1: Device Interfaces and Integration (CV-5V2)

Power from two sets of I/O supplies must be provided by the carrier over the SODIMM connector. Information on the individual I/O supplies and associated FPGA banks can be found on the Power page. See the FOMD-ACV-A4 Pins Reference for information on the power pin connections.

The FOMD-ACV is compatible with any standard 204-pin DDR3 SODIMM socket. Refer to the FOMD-ACV mechanical drawing on the Specifications page for detailed dimensions.

Thermal dissipation for the FOMD-ACV is highly dependent on the FPGA’s operating parameters and this can only be determined in the context of an actual target design. The type of FPGA cooling solution required for your design should be determined through thermal analysis and simulation as required.