Specifications

Host InterfaceUSB 3.0 Type C, SuperSpeed
FrontPanel Support
FPGAXC7S50-1CSGA
Memory512 MiByte DDR3, 32-bit wide data interface
NV Memory16 MiB System Flash
(15 MiB available for FPGA configuration boot or other storage)
Oscillator200 MHz
FPGA I/O VoltageSee Powering the XEM7305
MINIMUMTYPICALMAXIMUMUNITS
DC Input+4.5+5.0+5.5VDC
DC Input Ripple50mVp-p
Operating Temperature0+70ºC
Storage Temperature-500+100ºC
Weight15grams
Oscillator Frequency200MHz
Oscillator Freq. Stability±50ppm
Oscillator Period Jitter2.5ps RMS

PCB Footprint

mechanical drawing of the XEM7305 is available in PDF and image formats.  The PCB is 64mm x 42mm (2.52″ x 1.65″) with four mounting holes (M2 metric screws) spaced as shown in the figure.  These mounting holes are electrically isolated from all signals on the module.

The XEM7305 has a two 80-pin Samtec BSE connectors providing access to 108 I/O including 6 MRCC pins.

Mechanical Drawing

The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.

Mating Board Diagram

Use the mating diagram below to orient and design peripheral mating hardware. Note that this is a top-down view and mates to the top of the XEM7305. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.

For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.