Specifications

Host InterfaceUSB 3.0 Type-C
FrontPanel Support
FPGAXCAU15P-2FFVB676E
(XCAU15P-1FFVB676E available, minimum order quantities may apply)
FPGA Memory1 GiByte DDR4 (16-bit wide data interface)
NV Memory (System)16 MiB SPI Flash
NV Memory32 MiB QSPI FPGA Flash (supports FPGA gateware boot)
Clocks156.25 MHz fixed oscillator
Refclock inputs on Expansion Connectors
FPGA I/O52 HP I/O (Bank 64)
72 HD I/O (Banks 84, 85, 86)
FPGA MGT12 GTH transceivers (16.375 Gb/s)
(Note: 12.5 Gb/s for -1 Speed Grade)
Dimensions83 x 53mm (3.27 x 2.09″)
MINIMUMTYPICALMAXIMUMUNITS
DC Input+5+15.0VDC
DC Input Ripple50mVp-p
Operating Temperature0+70ºC
Storage Temperature-500+100ºC
Weight30grams
Oscillator Frequency (DDR4/FPGA Fabric)156.25 MHz

PCB Footprint

The XEM8305 PCB is 83 x 53mm (3.27 x 2.09″) with four mounting holes placed near the corners. These mounting holes are electrically isolated from all signals on the XEM8305. USB Type C is located along one edge of the PCB. Two 80-pin and one 100-pin expansion connectors are available on the bottom-side of the PCB. Power is connected through the expansion connectors.

Schematics

Electrical schematics are provided in redacted form through Pins Downloads. You must be a registered customer to download these schematics. The FrontPanel SDK and related design details are proprietary and confidential. Schematics related to the implementation have been removed and are unavailable.

Visit Pins Downloads > FPGA Board Schematics > XEM8305-AU25P-REV-Schematic.pdf

Mechanical Drawing

The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.

Mating Board Diagram

Use the mating diagram below to orient and design peripheral mating hardware. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.

For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.

Heat Sink

An active (fan-based) heatsink is available as an add on to install on the FPGA for cooling.

The XEM8305 is compatible with this clip on fansink, but it does not provide a power connector for the fan. Power for the fan must be provided by the carrier board.

MANUFACTUERPART NUMBER
Molex22232021
FANSINK MATING POWER CONNECTOR

The fansink is Radian part number FI27/1.3+Y+T725. The fansink has a nominal operating voltage of 12 V and a recommended operating range of 10.8 V to 13.2 V.