Specifications
| Host Interface | USB 3.0 Type-C FrontPanel Support |
| FPGA | XCAU15P-1FFVB676E |
| FPGA Memory | 1 GiByte DDR4 (16-bit wide data interface) |
| NV Memory (System) | 16 MiB SPI Flash |
| NV Memory | 32 MiB QSPI FPGA Flash (supports FPGA gateware boot) |
| Clocks | 156.25 MHz fixed oscillator Refclock inputs on Expansion Connectors |
| FPGA I/O | 52 HP I/O (Bank 64) 72 HD I/O (Banks 84, 85, 86) |
| FPGA MGT | 12 GTH transceivers (16.375 Gb/s) |
| Dimensions | 83mm x 53mm (3.27″ x 2.09″) |
| MINIMUM | TYPICAL | MAXIMUM | UNITS | |
|---|---|---|---|---|
| DC Input | +5 | – | +15.0 | VDC |
| DC Input Ripple | – | – | 50 | mVp-p |
| Operating Temperature | 0 | – | +70 | ºC |
| Storage Temperature | -50 | 0 | +100 | ºC |
| Weight | <SET> | grams | ||
| Oscillator Frequency (DDR4/FPGA Fabric) | 156.25 | MHz |
PCB Footprint
The XEM8305 PCB is 83mm x 53mm (3.27″ x 2.09″) with four mounting holes placed near the corners. These mounting holes are electrically isolated from all signals on the XEM8305. USB Type C is located along one edge of the PCB. Two 80-pin and one 100-pin expansion connectors are available on the bottom-side of the PCB. Power is connected through the expansion connectors.
Schematics
Electrical schematics are provided in redacted form through Pins Downloads. You must be a registered customer to download these schematics. The FrontPanel SDK and related design details are proprietary and confidential. Schematics related to the implementation have been removed and are unavailable.
Visit Pins Downloads > FPGA Board Schematics > XEM8305-AU25P-REV-Schematic.pdf
Mechanical Drawing
The mechanical drawing below may be used for enclosure or mounting hardware design. 3D Models are also available in SolidWorks, STEP, and IGES formats.
Mating Board Diagram
Use the mating diagram below to orient and design peripheral mating hardware. This design is realized in Altium CAD drawings in the corresponding breakout board which are available through Pins Downloads.
For Samtec connector details, drawings, models, and landing patterns, please visit Samtec’s website.
Heat Sink
An active (fan-based) heatsink is available as an add on to install on the FPGA for cooling. The XEM8305 is compatible with this clip on fansink, but it does not provide a power connector for the fan. Power for the fan must be provided by the carrier board.
| MANUFACTUER | PART NUMBER |
|---|---|
| Molex | 22232021 |
The fansink is Radian part number FI27/1.3+Y+T725. The fansink has a nominal operating voltage of 12 V and a recommended operating range of 10.8 V to 13.2 V.
